W25X10BVSNIG

1M-BIT, 2M-BIT, 4M-BIT and 8M-bit serial flash memory, 4KB sectors and dual output SPI, Low Power Consumption

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Price:: US $0.16~0.23 / piece [Get Latest Price]

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	US $0.16~0.23

PartNumber:: W25X10BVSNIG

Brand:: Winbond - Winbond | Pack: SOP | D/C: 11+

Availability:: Supply Ability: 10000/Week Can Ship Immediately
Delivery: 10-15 Business Days (ships out within 3 Business days)

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Products Upload time: 2011-11-17

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Part Number:W25X10BVSNIG
US $0.16 - 0.23
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Product Summary

The W25X10BVSNIG Flash memory provides a storage solution for systems with limited space, pins and power. The W25X10BVSNIG offers flexibility and performance well beyond ordinary Serial Flash devices. The W25X10BVSNIG is ideal for code download applications as well as storing voice, text and data. The W25X10BVSNIG operates on a single 2.7V to 3.6V power supply with current consumption as low as 5mA active and 1μA for power-down. It is offered in space-saving packages. The W25X10BVSNIG array is organized into 512/1024/2048/4096 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time using the Page Program instruction. Pages can be erased in groups of 16 (sector erase), groups of 256 (block erase) or the entire chip (chip erase). The W25X10BVSNIG erasable sector and 2/4/8/16 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage.

Parametrics

W25X10BVSNIG absolute maximum ratings: (1)Supply Voltage VCC: –0.6 to +4.0 V; (2)Voltage Applied to Any Pin VIO Relative to Ground: –0.6 to VCC +0.4 V; (3)Transient Voltage on any Pin VIOT <20nS Transient Relative to Ground: –2.0V to VCC+2.0V V; (4)Storage Temperature TSTG: –65 to +150 ℃; (5)Lead Temperature TLEAD: See Note (2) ℃; (6)Electrostatic Discharge Voltage VESD Human Body Model(3): –2000 to +2000 V.

Features

W25X10BVSNIG features: (1)Family of Serial Flash Memories; (2)SPI with Single or Dual Outputs; (3)Data Transfer up to 150M-bits / second; (4)Flexible Architecture with 4KB sectors; (5)Low Power Consumption, Wide Temperature Range; (6)Software and Hardware Write Protection; (7)Space Efficient Packaging.